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Metal Paste
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Silver Paste
Product property
- Nano silver particle offers excellent fine patterning with superior process capability- Wide range of curing temperature for plastic films (PET, PI, PVC, PE) & glass
- Conductivity is as low as bulk silver offering high conductivity even in micron scale patterned electrode
- For conventional & cutting-edge printing technologies
- Touch screen products
- OLED, EMI shielding, RFID, Flexible Display,
- FPCB(Flexible Printed Circuits Board)
Product Specification
AGP 200 series |
AGP 200H series |
|
|---|---|---|
Silver content(%) |
60 - 80(<400nm,1μm) |
60 - 70(<400nm,1μm) |
Viscosity(cps) |
10,000 - 30,000 |
20,000 - 50,000 |
Printing method |
Screen, Gravure, Off-Set |
Screen, Gravure, Off-Set |
Curing condition |
- 120 - 180℃ / 30min |
- Preheating : 120 - 150℃ / 10min - Firing temperature : 500 - 700℃ /10min |
Specific resistivity(Ωcm) |
< 10-5 (PET)(5μm) |
< 10-6(Glass)(5μm) |
Substrates |
Plastic film, Glass |
Glass, Ceramic |
Application
- RFID (Radio Frequency Identification)- FPCB (Flexible Printed Circuit Board)
- EMI (Electromagnetic Interference)
- Solar Cell
- Other Flexible Display and Printed Electronics
Copper Paste
Product property
High temperature paste- Screen printing process allows metal pattern formation
- A thermal sintering technique or a light sintering technique of a drying condition of 110℃ and a nitrogen atmosphere of 500℃ was applied
- Resistivity value 2 × 10 -5 Ω · ㎝ can be implemented
Low temperature paste
- Screen printing process allows metal pattern formation
- A thermal sintering technique or a light sintering technique of a drying condition of 110℃ and a nitrogen atmosphere of 250℃ was applied
- Resistivity value 2 × 10 -5 Ω · ㎝ can be implemented
- Easy application of metal plating technology
Product Specification
COP 100 series |
COP 100H series |
|
|---|---|---|
Copper content(%) |
60 - 70(< 1μm) |
60 - 70(< 1μm) |
Viscosity(cps) |
15,000 - 45,000 |
20,000 - 50,000 |
Printing method |
Screen, Gravure, Off-Set |
Screen, Gravure, Off-Set |
Curing condition |
- Preheating :110℃ / 5min - Sintering : : 250℃ / 20min |
- Preheating :120℃ / 5min - Sintering : 500 - 600℃ / (1-5min) ( Vacuum or Inert gas charge ) |
Specific resistivity(Ωcm) |
1x10-4 - 1x 10-5(Glass)(5μm) |
< 10-5 (Glass)(5μm) |
Substrates |
Polyimide film, Glass |
Glass, Ceramic |
Application
- RFID (Radio Frequency Identification)- FPCB (Flexible Printed Circuit Board)
- EMI (Electromagnetic Interference)
- Solar Cell
- Other Flexible Display and Printed Electronics
